Material Control - Heraeus Precious Metals

Bonding wires and substrates for the electronics industry have been part of the Heraeus product range for many years. In order to optimize and continually maintain the quality of these products a whole series of bonding machines and testing equipment is available covering many different types of wires (Au, Al, AlSi, Cu, Ø = 15 µm - 600 µm), foils and substrates. The bonding of a mini-series, for a pilot production run for example, is also an integral part of our service.

In addition we can replace electrical contacts, connection elements, components and modules in both one and multi-component waste gas units as well as condense water and salt spray evacuators. A temperature cycle test and pressure cooker test round off the possibilities.

Moreover, electrical and physical properties such as conductivity, capacity, inductance, breakdown voltage or temperature coefficients can be determined or leak tests be performed on housings.

Analyzing gas contents or traces of non-metals in metals and ceramics, together with an understanding of the surface covering of components is crucial towards being able to discontinue or to avoid certain physical and chemical characteristics. This procedure thus gains a further application, namely in the area of failure analysis, in the explicit development of certain materials, in the optimization of production processes and in quality management.

With the equipment available it is possible to determine elements even in the lowest ppm-range. In detail this means:

The sample is prepared according to the requirements both mechanically and chemically via a two- tier degreasing and suitable pickling process (organic/inorganic acids and composites).

The Metallographic Department is equipped with instruments including the most modern macroscopes, stereomicroscopes and metal microscopes with varying lightings and optical contrasting methods. For any supplementary tests micro- and low-load hardness testers are readily available.

Imaging is invariably generated using high resolution digital cameras. The competent application and further development of preparation techniques combined with the extensive device pool guarantee an optimal mechanical and chemical sample preparation.

The service criteria of the Metallographic Department focus heavily on the examination of precious, non-ferrous and refractory metals, their combinations with other materials such as ceramics or plastic in composite materials and parts, as well as in targeted and micro-preparations. Structural constituents, amongst other things, are registered and evaluated, together with the type and distribution of impurities, grain sizes, layer thicknesses and further geometric parameters.

Scanning Electron Microscopy (SEM) uses a lateral resolution of only a few nanometers and enables images of the topography and material differences at very high magnification. The integrated energy (EDX) and wavelength dispersive (WDX) X-ray analysis makes possible punctual, linear and flat image featured chemical analysis, and thus the identification and quantification of elements with a depth of information of several micrometers.

Scanning Auger Microanalysis (SAM) permits the analysis of the atomic composition of surfaces and thin films. Through sputter etching additional information can be won regarding the concentration process based on the depth.

Secondary Ion Mass Spectrometry (SIMS) enables, due to high levels of sensitivity, proof of the lowest concentrations (ppm) of an element on the surface of solid objects. Additionally, by using a finely focussed primary ion source one achieves a high lateral spatial resolution.

Photoemission Spectrometry (XPS) is used to analyze atomic composition and in the identification of chemical bonds on surfaces and in thin films.

Ultra modern technologies are applied in the processing of reactive and refractory metals. The department responsible for melting and glowing technology tests and optimizes for you the production of new materials. High purity metals and alloys are melted, glowed, and if necessary, worked into semifinished wires and sheets.

The following melting and glowing processes are available: